Kester: Leading Supplier of High Performance rosin core solder !
Kester Lead Free Solder Paste!
Kester Lead-Free Solder Paste..Lead-Free No-Clean Formula - For Stencil Printing Kester NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys. NXG1 is capable of stencil printing downtimes up to 120 minutes with an effective first print down to 20 mils without any kneading. NXG1 also offers excellent cosmetic appearance in the reflowed solder joints with smooth, shiny solder and light colored residues.NXG1 is classified as Type ROL1 flux under IPC ANSI/J-STD-004A.
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Kester Lead Free Solder Wire
SAC 305) Sn96.5 Ag3.0 Cu0.5 Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes. The use of 275 No-Clean Flux results in an extremely clear post-soldering residue without cleaning. The unique chemistry in Kester 275 was also designed to reduce spattering, common to most core fluxes. Kester 275 can be used for both lead bearing and lead-free soldering.
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